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Recently, the ICT industry groups undertake projects of the State Grid Corporation: localization of high-performance SOC master chip development and UHF radio frequency temperature sensor chip research and application of suitable monitoring and control equipment was officially launched. ICT Industry Group research, targets, evaluation indicators, the division of work, schedule and budget situation were refined, and the next phase of work carried out a detailed arrangements.
Suitable for monitoring and control equipment, high-performance master chip SOC localization of R & D projects mainly on the monitoring and control equipment in power transmission and distribution system to analyze the main chip, the localization research on this basis, through the integrated floating point arithmetic unit, PWM modules and high-precision ADC modules developed high-performance SOC control chip, running at up to 150MHz, the product can fill the gaps in performance than similar foreign products.
UHF RFID temperature sensor chip research and application projects intends to use temperature monitoring technology based on radio frequency identification (RFID) principle, through the "passive temperature" and "wireless transmission" two key technologies to address the current temperature of various types of electrical equipment Monitoring technical limitations exist. The temperature sensor is embedded by standard UHF (UHF) band RFID tag, in the same chip to achieve the integration of the "temperature sensing" and "RFID technology" seamlessly integrated temperature sensor and a passive RFID chip, does not affect electrical equipment insulation under the premise, to achieve power equipment temperature sensor miniaturization, low cost, low power consumption and other key core technology. With this chip passive wireless temperature monitoring system composed of both "passive" and "wireless" two features, with safe, reliable, low-cost, real-time, easy maintenance, etc., will provide optimum power temperature solution.

Recently, the ICT industry groups undertake projects of the State Grid Corporation: localization of high-performance SOC master chip development and UHF radio frequency temperature sensor chip research and application of suitable monitoring and control equipment was officially launched. ICT Industry Group research, targets, evaluation indicators, the division of work, schedule and budget situation were refined, and the next phase of work carried out a detailed arrangements.

Suitable for monitoring and control equipment, high-performance master chip SOC localization of R & D projects mainly on the monitoring and control equipment in power transmission and distribution system to analyze the main chip, the localization research on this basis, through the integrated floating point arithmetic unit, PWM modules and high-precision ADC modules developed high-performance SOC control chip, running at up to 150MHz, the product can fill the gaps in performance than similar foreign products.

UHF RFID temperature sensor chip research and application projects intends to use temperature monitoring technology based on radio frequency identification (RFID) principle, through the "passive temperature" and "wireless transmission" two key technologies to address the current temperature of various types of electrical equipment Monitoring technical limitations exist. The temperature sensor is embedded by standard UHF (UHF white card) band RFID tag, in the same chip to achieve the integration of the "temperature sensing" and "RFID technology" seamlessly integrated temperature sensor and a passive RFID prelam chip, does not affect electrical equipment insulation under the premise, to achieve power equipment temperature sensor miniaturization, low cost, low power consumption and other key core technology. With this chip passive wireless temperature monitoring system composed of both "passive" and "wireless" two features, with safe, reliable, low-cost, real-time, easy maintenance, etc., will provide optimum power temperature solution.